Heat and mass transfer data hand book pdf

This article is about components used to cool electronics. A heat sink is designed to maximize its surface heat and mass transfer data hand book pdf in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink.

A heat sink is usually made out of copper or aluminium. Copper is used because it has many desirable properties for thermally efficient and durable heat exchangers. First and foremost, copper is an excellent conductor of heat. This means that copper’s high thermal conductivity allows heat to pass through it quickly. Aluminium heat sinks are used as a low-cost, lightweight alternative to copper heat sinks, and have a lower thermal conductivity than copper. The fluid medium is frequently air, but can also be water, refrigerants or oil. If the fluid medium is water, the heat sink is frequently called a cold plate.

Practical heat sinks for electronic devices must have a temperature higher than the surroundings to transfer heat by convection, radiation, and conduction. As such, a heat sink is included in the design to disperse heat. Sketch of a heat sink in a duct used to calculate the governing equations from conservation of energy and Newton’s law of cooling. Consider a heat sink in a duct, where air flows through the duct. It is assumed that the heat sink base is higher in temperature than the air.